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1. T. W. Williams and K. P. Parker, Design for Testability A Survey, Proceedings of the IEEE, vol. 71, no. 1, January 1983, pp. 98 112. 2. M. Bullock, Designing SMT Boards for In-Circuit Testability, Proceedings of the International Test Conference, Washington DC, September 1987, pp. 606 613. 3. IEEE Standard 1149.1-1990, Standard Test Access Port and Boundary-Scan Architecture (includes IEEE Standard 1149.1a-1993), IEEE Inc., 345 E. 47th St., New York, NY 10017, USA. 4. IEEE Standard 1149.4-1999, Standard for a Mixed-Signal Test Bus, IEEE Inc., 345 E. 47th St., New York, NY 10017, USA. 5. K. P. Parker, The Boundary-Scan Handbook: Analog and Digital, 2d ed., Kluwer Academic Publishers, Norwell, MA, 1998. 6. K. P. Parker, J. E. McDermid, and S. Oresjo, Structure and Metrology for an Analog Testability Bus, Proceedings of the International Test Conference, Baltimore, MD, October 1993, pp. 309 322. 7. R. W. Allen Jr. et al., Ensuring Structural Testability of High-Density SMT Circuit Packs, AT&T Technical Journal, March/April 1994, pp. 56 65. 8. K. P. Parker, Integrating Design and Test: Using CAE Tools for ATE Programming, Computer Society Press of the IEEE, Washington, DC, 1987. 9. K. P. Parker, The Impact of Boundary-Scan on Board Test, IEEE Design and Test of Computers, August 1989, pp. 18 30.

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Printed circuit boards, like everything else in the electronics industry, have been undergoing rapid technological evolution This is only natural because everything, from the boards themselves, to the CAD systems that create them, to the components that populate them, to the assembly methodologies used to fabricate them, has been undergoing similar changes These changes have common themes: greater functional density, better performance, improved reliability, and lower cost In the early 1990s, the move toward surface-mount technology (SMT) accelerated to the point that SMT designs became the rule SMT supplanted, in large part, the familiar 100 mil centered through-hole package technology The change came slowly, embraced by leadingedge applications that needed the density improvements that came with SMT Many held back because they did not have a need for higher densities and could not justify the risk of putting new processes in place to manufacture with SMT.

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Midsized rooms are most often used for team meetings, training sessions, or smallgroup functions. The following descriptions will help you choose the most appropriate arrangement for your meeting.

The process of perfecting SMT brought to light a surprising fact it was more efficient once the necessary automation was put in place and perfected There are now applications that use SMT not because of the density improvements it affords, but rather because of the efficiency it provides This is confirmed by the fact that many new devices can no longer be obtained in the old-style through-hole packages Along with SMT came increases in lead pitch density First there was 50-mil pitch; soon came 25-mil pitch, then came 15-mil pitch, and so on Other technologies such as tape automated bonding (TAB), chip-on-board (COB), multichip modules (MCM), and ball grid arrays (BGAs) are gaining acceptance The industry has for some time been in the midst of a packaging revolution This revolution has applied to boards as well.

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The average board, by virtue of high-density interconnect (HDI), now has more layers, finer lines and spaces, buried vias, devices mounted on both sides, and so forth The net result is that loaded printed circuit boards are becoming incredibly densely packed with highly sophisticated components We are in fact experiencing a density revolution Figure 551 shows a range of common electronic devices superimposed on a penny to show scale Testing has been impacted by all these changes If perfect components were fed through perfect processes utilizing perfect machines run by perfect employees testing would not be needed! Unfortunately, nearly perfect components are fed through processes that are subject to drift in many of the hundreds of variables that govern them, using machines that require careful calibration and preventive maintenance, operated by people who tire and err For these reasons, testing is still an important part of loaded board manufacturing.

However, as a result of the miniaturization brought on by the density revolution, our ability to gain the physical and.

FIGURE 55.1 A US penny shows the size of some common PC board components, some older, some recent. The small black devices near Lincoln s bow tie are 04-02 (40 20 mils) surface-mount resistors. (Now 02-01 [20 10 mils] devices are being used.) Some 100-, 75-, and 50-mil test probes are shown for comparison. Note the lettering on the penny is done with 10-mil lines and the width of the circular part of the 9 is 35 mils, a common probe target size. (Photograph courtesy of Agilent Technologies.)

electrical access needed for testing purposes is increasingly hampered. Because access to a circuit is crucial for testing, accessibility difficulties make testing steadily more difficult to accomplish. On top of this, the electronics industry is expected to provide continued improvements in cost, reliability, and quality. Testing plays a crucial role in these improvements, as will be seen.

In the earliest years of the electronics industry indeed, before anyone may have called it an industry there was no concept of test. A product was put together and shipped, because inherent in the putting together was a basic appreciation for how the product was supposed to look and behave. This crafting quickly gave way to mass production* of somewhat more complicated items by workers who were not themselves experts in the craft. Of course, today, workers with little or no fathoming of what it is they are producing turn out items of unbelievable complexity. If they had to know everything about the process, it would undoubtedly be too expensive to make the product.

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