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The following discussion provides a brief overview of the family of standardized criteria for materials associated with acceptable production standards 521232 J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires This standard prescribes the recommended test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wire, stranded wire, lugs, and tabs Solderability evaluations are made to verify that the solderability of component leads and terminations meets the requirements established in J-STD-002 and that subsequent storage has had limited adverse effect on the ability to solder components to an interconnect Determination of solderability can be made at the time of manufacture, at receipt of the components by the user, or just prior to assembly and soldering Similar to J-STD-001, J-STD-002 has its origin with military standards, which in this case was MIL-STD-202, Method 208.

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It defines standardized methods of evaluating the ability of a surface to accept solder and in addition defines the durability of the solderable surface with three categories of product and related conditioning to determine the product performance before soldering Category 1 is the least demanding performance, where the product would be used soon after testing, and Category 3 is applied where the product may be stored for extended periods of time before soldering The intent is to identify solderability problems before the expense of production is added or the production schedule is delayed while waiting for solderable replacement parts For a more detailed discussion of solderability and the related issues, refer to Sec 525 521233 J-STD-003, Solderability Tests for Printed Boards J-STD- 003, Solderability Tests for Printed Boards, was released in April 1992 to complement the requirements of J-STD-001.

This standard prescribes the recommended test methods, defect definitions, and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes The solderability determination is made to verify that the PCB fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the PCB intended to be soldered This is determined by evaluation of the solderability specimen portion of a board, or representative coupon, that has been processed as part of the panel of boards and subsequently removed for testing per the method selected The objective of the solderability test methods described in J-STD-003 is to determine the ability of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder and to withstand the rigors of the PCB assembly processes For a more detailed discussion of solderability issues, refer to Sec 525 5212.

34 J-STD-004, Requirements for Soldering Fluxes J-STD-004 prescribes general requirements for the classification and testing of soldering fluxes for high-quality interconnections This standard is a flux characterization, quality control, and procurement document for solder flux and flux-containing material This standard defines the classification of soldering materials through specifications of test methods and inspection criteria These materials include liquid flux, paste flux, solderpaste.

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