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Always consider the environment when you choose your clothes. If you are in a business environment, dress in a fashion that is acceptable within your industry or the industry of your audience. If you are headed out on the town after your talk, add or remove layers. Don t be the one who tries to change your industry s culture without expecting some negative pushback. Wear what ts you! If you re a size 10, don t wear your size 8s when you re presenting. Unless you are a supermodel, wearing anything ultra tight draws attention that isn t particularly attering. Generally, we behave more professionally when we re dressed more professionally, so give yourself the edge with your attire.

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Notes: a Does not violate minimum electrical clearance. b Fine-pitch leads require a minimum side fillet length of 0.5 mm (0.02 in.). c In the case of a toe-down lead configuration, the minimum heel fillet height (F) extends at least to the midpoint of the outside lead bend.

TABLE 52.5 Dimensional Criteria: J Leads Feature Maximum Side Overhang Maximum Toe Overhang Minimum End Joint Width Minimum Side Joint Length Maximum Fillet Height Minimum Heel Fillet Height Solder Thickness Lead Thickness Lead Width Dim. A B C D E F G T W Class I

50% (W) 25% (W)a Unspecified dimension, determined by designa 50% (W) 75% (W) Wetting is 150% (W) evident Solder does not touch package body (G) + 50% (T) (G) + (T) Wetting is evident Unspecified dimension, determined by design Unspecified dimension, determined by design

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52.4.2.6 Ball Grid Array (BGA) Components. BGA package components are a very popular design due to significant packaging density. This allows designers to get more function in a smaller space. The component package is virtually impossible to inspect visually as traditionally allowed with other components since the solder spheres are located beneath the component. If cost justification exists, either due to volume or reliability provisions such as could be the case on Class 3 equipment, x-ray equipment can be used to verify the position quality and integrity of the solder joints. This could be costly in terms of the upfront capital investment of the x-ray equipment, but may pay for itself many times over in customer satisfaction or the prevention of defective product. Other options may use the x-ray as a process development tool where once the process is stabilized, the inspection is reduced to sampling or eliminated completely.

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X-ray inspection can provide a visual depiction of the solder connection that must not contain solder bridges, incomplete reflow, attachment fractures, misalignment that violates minimum electrical clearance, or missing or damaged spheres. It s also considered defective for solder voids to displace more than 25 percent of a sphere (see Fig. 52.19).

FIGURE 52.19 Ball grid array (BGA), bottom view showing solder ball connection. (IPC)

Starting with the time coordinate, we have 2m F =2 1 t r d ds F t = = t t +2 1 2m t r

52.4.3 Use of Adhesives Adhesives can often be used in SMT and PTH applications. For SMT components, adhesive may be used to attach components to the bottom side of the PCB for mixed technologies (those containing both through-hole and SMT components). In some process flows, the SMT components are placed with adhesive between the solder pads; the PCB is processed through an adhesive curing cycle; then the components are wave soldered or reflowed onto the PCB along with the PTH components. In some processes, the adhesive is a temporary (soluble) attachment to stabilize the components during soldering and is to be removed after the solder is attached. In some extreme cases, the adhesive is used for both through-hole and SMT components to support the physical attachment of the components for severe operational conditions such as physical shock or vibration. Where intended to support the component physically, the attachment is specifically defined by drawing or individual requirements. The SMT components are acceptable as long as the adhesive has not contaminated the solder joint. If adhesive has contaminated the component solderable surface, lead, end cap, or PCB pad such that an acceptable solder joint is not achieved, the PCBA is not acceptable (see Fig. 52.20). Normally in PTH component applications, adhesive is used to give large-profile and/or heavy components more mechanical stability. When adhesives are used in this manner, the following adhesive acceptance criteria apply:

The adhesive must adhere to a flush-mounted axial component for 50 percent of the component length and 25 percent of its diameter on one side. The build-up of adhesive should

FIGURE 52.20 Adhesive visibly extended from under the component and visible in the terminal area. (IPC)

not exceed 50 percent of the component diameter, and adhesion to the mounting surface must be evident (see Fig. 52.21). The adhesive must adhere to a vertically mounted axial component for 50 percent of the component length and 25 percent of its circumference, and adhesion to the mounting surface must be evident (see Fig. 52.22).

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Topic: datamatrix · GitHub
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