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Decreasing or eliminating thermal shocks by preheating the board before hot-air leveling, wave soldering, rework with a solder pot, etc. Decreasing the size of the thermal cycle (see Fig. 57.52). Decreasing the size of the thermal cycle is the single most effective measure for increasing the life of the PTH, especially if the thermal cycle exceeds Tg. Decreasing the free thermal expansion of the laminate over the thermal cycle. The free thermal expansion can be reduced primarily by choosing a laminate material with a higher Tg, but also by choosing a laminate material (e.g., with Aramid fibers) with a low CTE below Tg (see Fig. 57.6). Decreasing the PTH aspect ratio (usually quoted as board thickness divided by finished hole size) by decreasing the board thickness or increasing the hole diameter (see Fig. 57.7). Aspect ratios tend to be higher in boards with eight or more layers because of their thickness and via density; aspect ratios greater than 3:1 require good-quality plating and aspect ratios higher than 5:1 are not recommended, in part because of the difficulty of achieving adequate plating thickness in the center of the barrel. Increasing the Cu plating thickness (see Fig. 57.82). Increasing the plating thickness also increases the distance a fatigue crack must propagate to cause an electrical failure. Using Ni plating over the Cu (see Sec. 57.5.1.3 for more discussion). The ratio ef / e can be increased by:

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Increasing the Cu ductility (increases ef) and yield strength (decreases e). Cu strength and ductility are often inversely related, so these two factors must be balanced against one

% Strain in barrel (referenced to 250 C)

Test conditions: 10 1 MIL-STD-202 DM107C 65 C/30 min 125 C/30 min 2 MIL-STD-202 DM107C 65 C/30 min 150 C/30 min 3 Oil dip 25 C/5 s 50 100 260 C/5 s 200

150 Temperature ( C)

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FIGURE 57.5 Peak temperature vs. number of cycles to failure by PTH barrel (solid bars) or corner (dashed bars) cracking in three different tests. Calculated lines are shown for comparison. Results are for pyrophosphate copper and FR-4. Other parameters are total strain energy required to cause fracture, 50 J/cm3; hole radius, 0.45 mm; distance from hole center to free end, 0.8 mm; plating thickness, 0.02 mm; distance from hole center to pad edge, 0.8 mm; board thickness, 2 mm. Results from Ref. 2.

Using this along with (12.4), we can rewrite R as R = 1 e 2 f + r e 2 f df = 1 C + K r 2 + K r 2 = 1 C + 2K r 2 dr

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another. However, the strength-ductility relationship can be altered by the choice of plating bath and plating conditions. The number of cycles to failure can be dramatically decreased by defects in the hole wall or Cu plating in the hole or PTH knee that act as stress concentrations (increasing the local stresses and strains) and/or facilitate crack initiation. Because of the importance of this failure mode, it has been extensively studied experimentally and with analytical modeling techniques and more quantitative models are available.3,4,5 Laminate and Cu/Laminate Adhesion Degradation. When a PCB is exposed to elevated temperatures for long periods of time, the adhesion between the Cu and the laminate and the flexural strength of the laminate itself will gradually degrade. Discoloration is usually an early symptom. Several standards tests are used to compare the thermal resistance of different laminate materials. Cu adhesion is measured using a peel test.6 Adhesion at elevated temperatures or after elevated temperature exposure gives some insight into the ability of the material to withstand rework and other high-temperature processes. Flexural strength stability is compared by measuring the times at 200 C before the flexural strength decreases to 50 percent of

PTH diameter, mm 0.25 5000 2000 Number of thermal cycles 1000 500 200 100 50 20 10 0.010 0.020 0.030 PTH diameter, in 0.040 Tg 94 C Tg 152 C Tg 116 C 0.50 0.75 1.0

FIGURE 57.6 Effects of substrate Tg and PTH diameter on mean number of cycles to failure. The thermal cycle was 2-h cycle with extremes at 62 and +125 C. Multilayer printed circuit board thickness 0.10 in (2.5 mm); Cu in unfilled PTH is 1.2 mil (30 m) thick. Results from Ref. 33.

FIGURE 57.7 Cycles to failure vs. PTH aspect ratio for 65 to +125 C thermal shock cycles. Various hole diameters, board thicknesses, and board constructions. (After Ref. 3.)

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