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15, in which the sample panel is bent flat parallel to the axis along which current is varied26 Fractures occur at current densities producing low-ductility copper This test can also be used to evaluate the influence of bath chemistry on ductility or as a bath monitor Poor copper ductility can be correlated to the microstructure observed in metallographic cross sections27 57413 Drilling and Desmear Poor drilling and desmear (etchback) can cause PTH failures by providing stress concentrations that cause fatigue cracks to initiate They can also cause voids and cracks at the interface to the copper FIGURE 5715 Ladwig panel ductility test (After Ref 26) plating, which can trap chemicals during plating and then contribute to conductive anodic filament growth. rdlc barcode 128 How to Generate Code 128 Barcode in RDLC Reports
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Have you tried anything so far? Have you tried searching this ijnn Google? Ok. If you still want some suggestions then check following article- The following paragraphs describe the effects of poor desmear and some drilling defects which can cause poor plating, such as resin smear, rough walls, loose fibers, and burrs Resin smear can cause weak connections between plated-through-holes and innerlayer copper that fail under environmental stress There is always some resin smear, which is removed by the desmear (etchback) process If the desmear process is not effective, or if the resin smear is excessive, poor interconnection to the innerlayers can result Possible causes of excessive smear are a dull drill or the wrong feed rate or drill speed, all of which can cause increased drill heating, resulting in more smear.. rdlc barcode 128 How to add Barcode to Local Reports (RDLC) before report ...
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Step 1: For the Basic of RDLS report follow this link: Create RDLC report. Step 2: Download the bar code font 3 of 9 from this site: Barcode Font. Similar errors in drilling setup can cause rough hole walls, loose fibers, or burrs These defects are not serious in and of themselves, but can lead to rough plating or copper nodules, which introduce stress concentrations Rough walls are typically associated with an incorrect feed rate or drill speed, or insufficiently cured material Loose fibers may be caused by incorrect drilling parameters or improper cleaning Burrs are usually associated with too fast a drill feed or a dull drill Poor drill registration can also decrease reliability of innerlayer via connections or the soldered connection to through-hole components Poor registration can cause breakout on innerlayers; ie, the drill hole may fall outside the pad on the innerlayer it is intended to connect to Breakout increases the probability of PTH barrel failures. rdlc barcode 128 Code 128 RDLC Barcode Generator, generate Code 128 images in ...
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Jun 4, 2014 · The tutorial explains how to generate Code 128 barcodes in Visual Studio using barcode fonts ...Duration: 8:15 Posted: Jun 4, 2014 Breakout on outerlayers means that the solder fillet for a through-hole component will be partially missing, resulting in decreased reliability for some critical components Whether caused by excessive resin smear or not, poor etchback can result in a weak connection between the plating in the hole and the innerlayer copper Etchback (see Fig 5716) removes laminate resin and woven glass in the hole so that the internal copper projects slightly into the hole, permitting the plating to make contact with the innerlayer foil on three sides This strength is important to prevent cracking at the interface under thermal shock conditions A review of innerlayer cracking in or around the electroless copper at the junction between the innerlayer foil and the electroplated Cu in the hole suggests that negative etchback, in which the electroplated Cu projects into the laminate may also give good results. Zero etchback, when innerlayer foil is flush with the hole wall, is the most dangerous case because the bond line between the foil and the plated copper is located at the point of maximum stress28 Causes of insufficient etchback include improper lamination and curing, hardened epoxy smear, a depleted smear removal bath, or a host of process control issues, including improper bath temperature, agitation, or time exposure.. FIGURE 57.16 Schematic illustrations of positive, flush, and negative etchback. (After M.W. Gray.28) 57.4.1.4 Plating. Defects from the plating process can be responsible for a variety of PTH reliability problems; in addition, as previously described, problems in earlier process steps such as drilling and desmear often show up as plating defects. Uniform coverage of the hole with electroless Cu is critical to the strength of the throughhole and the adhesion of the metallization to the laminate. Oxidation of the innerlayer copper prior to electroless Cu plating is one source of poor plating adhesion. Poor control of bath composition can have the same effect. The adhesion of the electroplated Cu to the electroless Cu and the ductility of the electroplated Cu also strongly affect PTH reliability. If the adhesion between the layers is poor, this interface may be the weak point where failure initiates when the PTH is subjected to thermal stresses. Causes can include tarnished electroless copper that is insufficiently microetched, burning the electroless copper with too much current in electrolytic plating, and film contamination rdlc barcode 128 RDLC Code 128 Creator generate Code 128, Code 128a, Code ...
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