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Formation of an intermetallic layer at the solder interface indicates good metallurgical bonding, but thick intermetallic layers are undesirable because intermetallics are brittle and prone to fracture, especially if the joint is stressed in tension rather than shear Because solder joint fatigue takes place in the solder rather than in the intermetallics or at the solder/intermetallic interface, the basic mechanism is unaffected Nonetheless long reflow times and the accompanying thick intermetallic layers should be avoided Cross-sectioning can be used to judge the extent of intermetallic growth; as long as the intermetallic layer thickness is relatively small compared to the joint thickness, reliability should not be adversely affected30 (Note however that minimizing reflow time is still a good thing; the reliability of all the components on the board is adversely affected by time at elevated temperature, both during processing and in service.

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Unfortunately, in developing a reflow profile, there is often a tradeoff between reflow time and peak temperature) Cleanliness Issues An improper reflow profile can also cause solder balling and increase the amount of flux residue remaining on the board after reflow The reliability concerns associated with these process issues are discussed in Sec 57424 Solder balls can be caused by a combination of improper paste storage or handling, incompatibility between the flux and reflow atmosphere, and a reflow profile that does not conform to the manufacturer s specification 57423 Wave-Soldering Process Improper wave-soldering practice can cause reliability problems The root cause is generally thermal shock, overheating of the top side of the board, or contamination of the solder bath Component Cracking Ceramic components such as resistors and capacitors will crack under thermal shock conditions.

When they are located on the bottom of the board they can be heated rapidly by the solder wave Prevention is relatively simple; the assembly must be preheated before it hits the solder wave A temperature difference between the component and the solder wave of less than 100 C is recommended; a typical preheat temperature is 150 C..

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Recent evidence indicates that the expansion of the universe is accelerating, and this is consistent with a nonzero cosmological constant. The cosmological constant represents vacuum energy that is modeled as a perfect uid with the condition that = p.

FIGURE 7.19 Expanded Teflon (left) and a PCB cross section showing prepreg using expanded Teflon (right). (Courtesy of W.L. Gore and Associates.)

A resin system is applied to the expanded Teflon structure and is made into a b-staged sheet capable of bonding printed circuit layers together.This material can be used to make prepregs for high-frequency applications and is shown in Fig. 7.19.

The primary conductive material used in printed circuits is copper foil. However, the trend toward circuit densification has brought about recent developments in copper foil technology as well. In addition, copper foils subsequently plated with other metal alloys are employed to manufacture printed circuits with resistive components buried within a multilayer structure. Copper foil grades are shown in Table 7.7.

TABLE 7.7 Foil Grades from IPC-4562 Grade 1 2 3 4 5 6 7 8 9 10 11 Foil Description Standard electrodeposited (STD-Type E) High-ductility electrodeposited (HD-Type E) High-temperature elongation electrodeposited (HTE-Type E) Annealed electrodeposited (ANN-Type E) As rolled-wrought (AR-Type W) Light cold rolled-wrought (LCR-Type W) Annealed-wrought (ANN-Type W) As rolled-wrought low-temperature annealable (LTA-Type W) Nickel, standard electrodeposited Electrodeposited low temperature annealable (LTA-Type E) Electrodeposited annealable (A-Type E)

Electrodeposited Copper Foil The most common foil used in manufacturing printed circuits is electrodeposited copper foil (ED foil). ED foil is produced through an electrochemical process in which copper feed stock or scrap copper wire is first dissolved in a sulfuric acid solution.The purified copper sulfate/ sulfuric acid solution is then used to electroplate copper onto a cylindrical drum typically made from stainless steel or titanium. Figure 7.20 illustrates the overall process used to make electrodeposited copper foil. This process results in a copper foil with a relatively smooth, shiny side, and a coarser matte side, as illustrated in Fig. 7.21.The shiny side mirrors the surface

Clean solution Electroplating cell + Spent solution Precoat filter Slitting Main solution storage Sludge to disposal Cartridge filter Cartridge filters Treating

of the plating drum, while the microscopically rough matte side is formed by the copper grain structure. By controlling the plating solution chemistry, the surface condition of the plating drum, and the electroplating parameters, one can modify the properties of the copper foil for various usage environments. For example, mechanical properties such as tensile strength and elongation, as well as the surface profile of the matte side, can all be adjusted through control

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