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of these process variables. The foil produced in this process is then run through a treatment process. This treatment process typically plates copper nodules that further roughen the surface for adhesion, and also applies other metal barrier layers and antitarnish coatings, as shown in Fig. 7.22. Standard copper foil area weights and thicknesses were shown in Table 6.4. The foils most commonly used in printed circuit manufacturing are Grade 1 and Grade 3 foils. Unlike Grade 1 foil, Grade 3 foil must meet specific elongation requirements at elevated temperatures (180 C). Grade 3 foil also commonly referred to as high-temperature elongation, or simply HTE foil is widely used in base laminates employed to manufacture multilayer printed circuit boards. The increased ductility at elevated temperatures provides resistance to copper foil cracks when the multilayer circuit is thermally stressed and expands in the z-axis. Changes to the plating bath are made to alter the grain structure of HTE foil. This results in different mechanical properties. Tables 7.8 and 7.9 show the tensile strength and ductility requirements for standard Grade 1 copper foil and high-temperature elongation Grade 3 copper foil. These requirements come from IPC-4562, Metal Foil for Printed Wiring Applications, which lists requirements for the other grades as well. The surface profile of the copper foil is also important in printed circuit manufacturing. On one hand, a relatively rough surface profile aids in the bond strength of the foil to the resin system. On the other hand, a rough profile may require longer etching times, which impact productivity and the geometry of the etched features. With longer etching times, propensity to rdlc ean 13 EAN - 13 Client Report RDLC Generator | Using free sample for EAN ...
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Features: - Linear, Postal, MICR & 2D Barcode Symbologies - Crystal Reports for .NET / ReportViewer RDLC support - Save barcode images in image files ... The advantage to taking questions throughout your presentation is that any confusion your listeners have can be clari ed immediately, and you can speak directly to their concerns. The major disadvantage is that the sequence, emphasis, and your major message can get lost when you give oor time to individual audience members. Any listener with a personal agenda can grandstand during your allotted time. Taking questions during your performance tends to give the presentation a more informal tone and may be the best technique to use with small groups or as you become a more experienced presenter. Taking questions during a talk requires exibility and often demands more time for the total presentation. TABLE 7.8 Tensile and Elongation Properties of Grade 1 Copper Foil Property @ 23 C Tensile strength: kpsi MPa Elongation % rdlc ean 13 Packages matching RDLC - NuGet Gallery
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R2 is the same value as X. Thus, the outcome of a sequence of two XORs using the same value produces the original value. To see this feature of the XOR in ... Hot Cracking Hot cracking, also known as partial melting, can cause previously sound solder joints to fail during the wave-soldering process A typical mixed TH/SMT assembly is manufactured by assembling the surface-mount components to the top side, inserting the through-hole components, and wave soldering these components to the board from the bottom side The first step of the wave-soldering process usually involves preheating the entire board During the wave-soldering process, the SMT joints on the top side will be further heated due to conduction of heat through the board, particularly if there are many vias If these solder joints reach the melting temperature of the solder (usually 183 C), the joints will begin to melt. rdlc ean 13 RDLC EAN 13 Creator generate EAN 13(UCC-13 ... - Avapose.com
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Barcode Generator for .NET RDLC Reports, integrating bar coding features into . NET RDLC Reports project. Free to download evaluation package. If the joints melt completely, the assembly may be intact after reflow; however, if they only begin to melt, the surface tension of the solder is insufficient to prevent cracks from forming between the portions that are still solid This type of failure is often detected as an intermittent in the field, since in-circuit test fixtures may bring the two halves of the joint into mechanical contact, causing the joint to appear electrically good Solder Bath Contamination Solder bath contaminant levels should be regularly monitored and limited to levels found in IPC-S-815 Many metals found on component terminations will dissolve into molten eutectic Sn-Pb solder High Cu concentration is a relatively common occurrence that is associated with a rough solder surface and causes poor solderability High Au concentrations can embrittle solder joints (see Sec 57513 for a discussion of this phenomenon) 5742. 4 Cleaning and Cleanliness Improper handling procedures and improper selection and application of solder paste and wave-solder fluxes and their associated cleaning processes can cause ionic residues to be left on the board that result in low surface insulation resistance Low SIR values can cause failures in and of themselves for some sensitive circuits and in other cases set up the conditions for further corrosion that eventually result in short circuits Sodium and potassium ions and halide ions are the most commonly quoted culprits for these failuresThe major source of sodium and potassium ions is handling, ie, fingerprints The primary sources of halide ions are soldering fluxes The elimination of chlorofluorocarbons (CFCs) mandated by the Montreal Protocol has caused most SMT manufacturers to switch to water cleaning or a no-clean process. rdlc ean 13 RDLC Report Barcode - Reporting Definition Language Client-Side
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