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Water cleaning has been used by most printed circuit board manufacturers for some time, but outgoing cleanliness was not carefully monitored since the boards were cleaned again after assembly Both the no-clean and water-clean assembly approaches must meet certain criteria to provide reliable assemblies In a no-clean assembly process, there is no cleaning step after SMT or TH assembly The finished assembly has whatever contaminants were present on the incoming board and components, plus any additional contaminants added during the assembly process These contaminants are generally flux residues, both from the solder paste and the flux applied for wave soldering, although adhesives and fingerprints are other potential sources A no-clean flux should have a low solids content so that it leaves little residue and be free of ionic contaminants such as halides that promote corrosion. rdlc pdf 417 PDF417 Barcode Creating Library for RDLC Reports | Generate ...
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Free trial package available to insert PDF - 417 barcode image into Client Report RDLC . Use of a flux that contains halides will result in low SIR readings and may result in shorting due to corrosion, particularly if the assembly is exposed to a humid environment However, the incoming components and boards are cleaned, it is important that they are also free of halides when they arrive for assembly Although SIR testing provides the best correlation with reliability, an ionic contamination test may be used for statistical process control The measurement method may be found in MIL-P-28809 Solder balls may also be a problem on no-clean assemblies Solder balls are formed during reflow of solder paste when some solder is left behind when the solder melts and beads up and by spattering during wave soldering These solder balls are usually washed off by solvent or water cleaning; however, in a no-clean process they remain on the board. Solder balls can cause shorts by bridging the pads of small capacitors or resistors or the leads of fine-pitch quad flat packs In a water-clean assembly process, the assemblies are cleaned with jets of deionized or saponified water after SMT and TH assembly This process will work only if the flux residues. rdlc pdf 417 How to add Barcode to Local Reports ( RDLC ) before report ...
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Barcode Control SDK supports generating Data Matrix, QR Code, PDF - 417 barcodes in RDLC Local Report using VB and C# class library both in ASP.NET and ... and other contaminants are sufficiently soluble in either water or saponified water It also depends on good access to the residues; consequently, a minimum component standoff that permits cleaning is required if it is possible for flux to get underneath the component body during assembly It is almost as important that the board be thoroughly dried because water is an excellent medium for galvanic corrosion Proper drying can be quite difficult even with substantial air flow since water has a much lower vapor pressure than CFCs do If the component standoff is low, capillary action holds water in the small gap If water cleaning is done in midprocess (eg, before a reflow or wave-soldering step), plastic components may absorb moisture; in this case, the board must be baked out to prevent package cracking in subsequent high-temperature processes (see Secs 5723 and 57422). The rework process should not be overlooked in planning a flux and cleaning strategy Compared to the automated processes that proceed it, it is typical to use a more aggressive flux and more of it to do rework Use of a halide-free flux or proper cleaning after rework is essential to prevent cleanliness-related reliability problems Finally, the cleaning process itself can damage the PCA Ultrasonic cleaning can damage components with internal wire bonds or die attach It has also been observed to cause fatigue cracking of solder joints to LEDs and SOT-23s when the energy density was high because these components have terminations that are mechanically resonant near the generator frequencies Solvent cleaning can attack the polymers used in solder masks, PCBs, conformal coatings, and components D-limonene (terpene)-based solvents should be tested carefully for compatibility with exposed plastics and metals 57425 Electrical Test and Depanel. The electrical testing and depanel processes can impose large mechanical stresses on the PCB and its components In-circuit electrical test utilizes a bed of nails or two beds in a clamshell arrangement to contact each electrical node on the boardThe probes must contact the board with sufficient force to make good electrical contact If the board is not properly fixtured or if the loading in a clamshell fixture is unbalanced, the resulting deflections can cause solder joint or component cracking These cracks may cause electrical failures immediately or after some period of service Depaneling, the process of separating individual images from a larger panel, is done by a variety of methods The associated mechanical deflections or vibration can cause component cracking or solder joint fatigue 57426 Rework.
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