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Generally, the reactive compounds are preferred since they are bound to the polymer backbone, which prevents release into the environment, and, in comparison to additives or fillers, they seem better suited to obtaining the desired material properties Table 72 summarizes some of the available halogen-free flame retardants Organic phosphorus-based flame retardants have become the most common alternative flame retardants used in printed circuit base materials However, others are also being used and combinations of two or more types of halogen-free flame retardants can also be used synergistically to achieve adequate flammability levels while minimizing adverse impacts on material properties Some of the adverse impacts that must be evaluated are moisture absorption, copper peel strength degradation, Tg reduction, changes in resin flow, degradation in mechanical or electrical performance, and the impact on Conductive Anodic Filament (CAF) resistance..

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TABLE 7.2 Halogen-Free Flame Retardants Type Phosphorus Primary Mechanism Forms char Examples Red phosphorus, ammonium polyphosphate, organic phosphorus compounds Considerations Red phosphorus is difficult to process and toxic. Organic phosphorus compounds are a common alternative, but generally more costly and can lower Tg. Inexpensive, but generally require high loadings and can degrade mechanical and other properties. Toxicity of antimonybased retardants is a concern. Can be used with other flame retardants synergistically. Impact on material properties and other environmental effects are concerns.

UV Blockers/Fluorescing Aids Some resins naturally absorb ultraviolet light. Others absorb very little. There are two reasons why this property is important. First, automatic optical inspection (AOI) equipment is often laser-based and relies on the resin system in the base material to fluoresce upon exposure. In this way, the AOI equipment can distinguish between the base laminate and the conductor pattern. The second reason involves photoimaging on very thin circuits, during the solder mask imaging process, for example. This process commonly involves exposure to ultraviolet (UV) light through an image of the desired pattern onto both sides of the circuit, which is coated with a mask or photoresist. The UV light initiates chemical changes to the photoresist, typically polymerization, which makes it less soluble in a developer solution. In very thin circuits, if the base material does not absorb UV light sufficiently, the UV light from one side of the circuit board can pass through to the other side and cause unwanted exposure of the photoresist on the opposite side. Therefore, components that absorb UV light are sometimes added to resin systems that do not sufficiently absorb UV light.

The charts in Figs. 16.5 through 16.8, called baseline charts, were developed from current carrying capacity testing using polyimide PWBs with no internal copper planes. Test vehicles were developed and current carrying capacity testing was performed following IPC-TM-6502.5.4.1a, Conductor Temperature Rise Due to Current Changes in Conductors. One internal data set, 1 oz. internal traces, and one external data set, 2 oz. external traces, on a 0.07 in. thick polyimide PWB, are presented. These two data sets are a subset of data collected for 1/2 oz., 1 oz., 2 oz., and 3 oz. copper weights, FR-4, and polyimide boards, and PWBs with board thicknesses of 0.965 mm (0.038 in.), 1.498 mm (0.059 in.), and 1.78 mm (0.07 in.). The other data sets are used to discuss the effect of the other variables with respect to the charts in Figs. 16.5 through 16.8.

Board thickness Traces in the 0.965 mm (0.038 in.) thick boards are approximately 30 to 35 percent higher in temperature than the 1.78 mm (0.07 in.) thick PWB data, and the 1.498 mm (0.059 in.) thick boards are 20 percent higher.