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where solder/Au is the ratio of the density of the solder to the density of Au (0.4552 for 63Sn37Pb solder). If the Au is less than 1 m thick, it is usually valid to assume that all of the Au on the joined surfaces has dissolved into the joint. The solder volume should include any solder plated on either the component or board termination as well as that applied by stencil printing. It is common to specify only a minimum Au plating thickness; it is important to use a representative value to calculate the expected Au content in the solder joint. ean 8 check digit excel formula EAN 8 : SYMBOLOGY, SPECIFICATION ... - Barcode-Coder
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Create and print EAN - 8 barcode in Excel spreadsheet. No check digit calculator. ... Free download EAN - 8 barcode generator for Office Excel . No barcode EAN - 8 ... Interconnect Material 57.5.2.1 Eutectic Sn-Pb Solder. Eutectic Sn-Pb solder, 63Sn-37Pb, and near-eutectic SnPb solders, including 60Sn-40Pb and 62Sn-36Pb-2Ag, are used in the overwhelming majority of soldered electronic assemblies. From a reliability perspective, the most important characteristics of these solders are their susceptibility to creep and fatigue because ambient temperatures are so close to the metal temperature of the solder, their ability to dissolve common termination metals rapidly and in large amounts, and their tendency to form thick intermetallic layers with termination metals. Although solder joint thermal fatigue is a major source of PCA field failures, the industry has used the same solder alloy for several decades. At present, there is no generally agreed-on alternative to eutectic Sn-Pb solder that has improved fatigue resistance as well as the favorable processing characteristics of eutectic Sn-Pb solder. However, there has been a tremendous surge in research into alternative solders, especially Pb-free solders, in the last decade and one can expect improved alloys in the future. There is some evidence that solders containing 2 percent Ag have improved properties in thermal cycling to high temperatures. Many common termination metals dissolve rapidly in eutectic Sn-Pb solder, including Ag, Au, and Cu.36 The dissolved metals can alter the properties of the solder. Reliability can also be impacted if the termination metal is dissolved entirely, the most notable case being Ag (or AgPd with less than 33 percent Pd) terminations on ceramic resistors and capacitors. If the entire ean 8 barcode excel EAN -13 Barcode in Excel 2016/2013/2010/2007 free download ...
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Create and produce EAN - 8 with proper human-readable data characters for Excel 2003 or later versions. termination thickness is dissolved, the solder will dewet from the ceramic part, leaving an open joint if the entire termination is dissolved, or a substantially weakened one if it is dissolved only in some areas Use of 63Sn-36Pb-2Ag substantially reduces this problem, since the presence of Ag in the solder reduces the dissolution rate of the Ag forming the termination Finally, eutectic and near-eutectic Sn-Pb solders form intermetallics with the termination metals that influence the properties of the finished joints On the most common termination metals, Cu and Ni, continuous intermetallic layers form: Cu3Sn and Cu6Sn5 on copper, and Ni3Sn4, Ni3Sn2, and Ni3Sn on nickel These intermetallic layers are composed of compounds that are hard and brittle in comparison to both the solder and the termination metals. excel ean 8 EAN 8 check digit formula? - Excel Forum
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27 Apr 2017 ... I can find boat loads of EAN 13 check digit calculators but no EAN 8 ...can anyone help me out with one? Found this one. Although there have been few systematic comparisons made, it is general wisdom that when the intermetallic layers are very thick, solder joint reliability is reduced While solder joint thermal fatigue mostly involves cracking in the solder, the intermetallics can affect their ability to withstand mechanical stresses, particularly in tension The Ni-Sn intermetallics are particularly brittle In every case, an effort should be made to minimize the total time the solder is molten during processing and to minimize the time above about 150 C once the solder joint is formed 57522 Other Solders A number of other solders are used in specialized applications, including 80Sn-20Pb for lead finishes, 50In-50Pb for solder on thick Au, high-Pb solders such as 95Pb-5Sn and 97Pb-3Sn for flip-chip assemblies (usually on ceramic substrates), and lowtemperature solders such as 58Bi-42Sn and 52In-48In, where hierarchical soldering is desirable Further information can be found in Refs. 23, 24, and 38 57523 Conductive Adhesives Electrically conductive adhesives are used today for specialized applications such as connections to LCD displays and attachment of small resistors and capacitors These materials consist of conductive particles, usually silver flakes or carbon, suspended in a polymer matrix, most commonly epoxy The electrical resistance of the contact to the PCB tends to be unstable over time, so these materials are not suitable for applications requiring a constant, low-resistance contact The primary failure mechanism is moisture migration through the epoxy to the interface, resulting in oxidation of the contact metal Adhesion strength is also a reliability concern New materials suitable for a broader range of applications are under development Further information can be found in Ref 39.. excel ean 8 Excel EAN - 8 Generator Add-In - How to Generate Dynamic EAN 8 ...
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