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When jumper wires are used on the primary side (component side) of the PCBA, no wire is to pass over or under any components for Class 2 or 3. The wire may pass over lands, provided the wire can be moved away from the land for component replacement. To prevent damage to the wire from excessive heat, care must be taken to avoid running wires near heatsinks or components that generate high temperatures. When jumper wires are used on the secondary side of the PCBA, the jumper wire should not pass through component footprints unless the layout of the assembly prohibits routing in other areas. If this condition occurs, it should be considered a process indicator. There is an exception to this is rule for edge connectors on the PCBA. Jumper wires should not pass over test points or vias used as a test point. Jumper wires should be staked to the base material with an approved adhesive or tape dots or strips intended for this purpose. If adhesives are used, they must be fully cured as part of printing code 39 fonts from microsoft word Code 39 Word Barcode Add-In. Free Download Word 2019/2016 ...
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No demo, genuinely free code 39 (3 of 9) barcoding fonts . ... All you really need to create a barcode using a font is a text editor such as Microsoft Word and a few ... the completed PCBA. The wire should be spot-bonded along its route and must not be applied to lands, pads, or components. The interval of staking must be defined in the applicable engineering documentation, but the wire must be staked at all changes in direction of the wire. No jumper wires may be staked to components that are socketed or any moving part. Jumper wires must be staked or taut enough to prevent the wire from rising above the height of adjacent components. No more than two jumper wires may be stacked on a given route. When a jumper wire is attached to leads on the secondary side of the PCBA or to axial components on the primary side of the PCBA, it must form a full 180 to 360 loop around the component lead. When a jumper wire is soldered to other component package styles, the wire should be lap-soldered to the component lead. Jumper wires may be installed into a PTH with another component lead for Class 1 and 2 equipment; however, this is unacceptable for Class 3 equipment. Jumper wires may also be installed into via holes (see Fig. 52.40). word code 39 barcode font download Get Barcode Software - Microsoft Store
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No demo, genuinely free code 39 (3 of 9) barcoding fonts. ... All you really need to create a barcode using a font is a text editor such as Microsoft Word and a few ... FIGURE 52.40a Example of jumper wire connected to plated through-holes (IPC). 1. ANSI/J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. 2. MIL-STD-2000, Standard Requirements for Soldered Electrical and Electronic Assemblies. 3. ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires. 4. ANSI/J-STD-003, Solderability Tests for Printed Boards. 5. IPC-A-610, Acceptability of Electronic Assemblies. This chapter covers why manufacturers inspect printed circuit assemblies, how they have implemented and enhanced visual inspection, what automated inspection systems they are using, and how they have implemented these automated systems The scope of this chapter includes only inspection of printed circuit assemblies during the assembly process, as typically shown in Fig 531 Thus, it includes inspection of solder paste after the paste printing process step, components after the component placement process step, and solder joints after the solder reflow process step Not included, however, is incoming inspection of components and the bare printed circuit board (PCB) The focus of this chapter is on production use of inspection, not the collection of measurements during process development in a research and development (R&D) environment 5311 Visual Inspection Manufacturers of printed circuit assemblies have always visually inspected their boards at various points in the assembly process. There are a variety of reasons for visual inspection of assemblies, including eliminating obvious process defects quickly and meeting military specifications With the advent and growth of surface-mount technology (SMT), visual inspection of printed circuit assemblies has also grown in importance and prevalence SMT solder joints must carry a much bigger burden for mechanical or structural reliability than do platedthrough-hole (PTH) solder joints The pin-in-through-hole solder joint carries much of the mechanical burden, helping to keep the component attached to the printed circuit board However, with SMT solder joints, it is often only the solder that keeps the component attached to the board In some cases, only visual inspection could judge the mechanical reliability of an SMT solder joint. As SMT geometries have continued to shrink and solder joints have become denser on printed circuit boards, visual inspection has become more difficult and thus its results have become less consistent and reliable In addition, components such as pin grid arrays (PGAs). FIGURE 53.1 Generic manufacturing process for surface-mount technology printed circuit assemblies, including the possible locations within the process for inspection or testing of mechanical or structural attributes and electrical characteristics of an assembly. or ball grid arrays (BGAs) completely hide their solder joints from view, which makes visual inspection not possible at all for those joints. As Fig. 53.2 indicates, achieving a high assembly process yield is more important as the number of solder joints per assembly increases. word code 39 Get Barcode Software - Microsoft Store
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